PCB Modeling and Thermo-Mechanical Coupling Analysis Case Study｜SimLab x OptiStruct

Software used: SimLab、OptiStruct
【 Background 】

There are several common challenges in PCB analysis modeling:

1. How to define the equivalent material properties for each PCB layer?

2. There are a large number of PCB components – how can they be simplified?

3. How to quickly build BGA models?

The main goal of this case is to quickly complete PCB modeling and then perform subsequent structural, heat transfer and other analyses.

【 Results 】

In this case, SimLab is used for modeling, and OptiStruct is used to perform thermo-structural coupled analysis.

1. SimLab can directly read ECAD data, obtain the metal content percentage of each layer, and generate equivalent material parameters accordingly.

2. SimLab provides a fast BGA creation tool, which can import coordinate csv files to quickly build BGA models.

3. SimLab also offers multiple convenient Hex meshing tools that enable efficient PCB model creation.

4. Analysis of thermal warpage regions of the PCB after thermal deformation.

【 Technical Features 】

• Complete PCB solution: signal analysis, structural thermal analysis, and thermo-structural coupled analysis.

• ODB++ import.

• Component simplification and filtering.

• PCB equivalent material modeling.

• Automatic BGA solder ball generation.

【 PCB Modeling and Thermo-Structural Coupled Analysis Case 】